1MIC 662XW DLF 3MIL TH 4.3 X NH*420A by 3M

3M™ Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over standard diamond lapping film. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades.3M Diamond Lapping Film 662XW is designed for faster processing and improved cut rate compared with our standard diamond lapping films. 3M films are longer lasting, with a faster cutting higher diamond concentration and a stronger resin bond than traditional lapping films. They offer a flat surface, with no rounding. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades in discs, rolls and sheets.